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Effect of Bonding Pressure and Bonding Time on the Tensile Properties of Cu-Foam / Cu-Plate Diffusion Bonded Joint
Effect of Bonding Pressure and Bonding Time on the Tensile Properties of Cu-Foam / Cu-Plate Diffusion Bonded Joint
2016
Chung-Yun Kang
Sang-Ho Kim
Hoe-jun Heo
Tae-Jin Yoon
Keywords:
Tensile testing
Composite material
Metallurgy
Materials science
Diffusion bonding
Ultimate tensile strength
pressure sensitive
Correction
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