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Direct on Chip Thermal Measurement in IGBT Modules Using FBG Technology -Sensing Head Interfacing
Direct on Chip Thermal Measurement in IGBT Modules Using FBG Technology -Sensing Head Interfacing
2021
Shiying Chen
D.S. Vilchis-Rodriguez
Sinisa Djurovic
Mike Barnes
Paul McKeever
Chunjiang Jia
Keywords:
Head (vessel)
Materials science
Insulated-gate bipolar transistor
Electrical engineering
Interfacing
Thermal
Correction
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