Soldering device and manufacturing method thereof

The soldering apparatus includes a soldering tip having a tip and a rear end. The said rear end of the soldering tip, the hole having a bottom is formed. On the bottom surface of the hole, accommodating recess is formed. In said hole, a heater is disposed. In said receiving recess, a temperature sensor located between the heater and the soldering tip distal end is disposed. In said receiving recess, the pipe is arranged. Pipe holds the temperature sensor in the accommodating recess, to ensure thermal conductivity between the soldering tip and a temperature sensor.