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Multilayer ceramic substrate for HEMT packaging (liquid nitrogen packaging for GaAs devices)
Multilayer ceramic substrate for HEMT packaging (liquid nitrogen packaging for GaAs devices)
1992
Shigenori Aoki
Y. Imanaka
K. Yokouchi
Keywords:
Liquid nitrogen
Ceramic
Electronic engineering
Substrate (chemistry)
Engineering
Field-effect transistor
Electronic packaging
High-electron-mobility transistor
Flip chip
ceramic substrate
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