Critical factors affecting the 3D microstructural formation in hybrid conductive adhesive materials studied by X-ray nano-tomography

Conductive adhesives are found favorable in a wide range of applications including a lead-free solder in micro-chips, flexible and printable electronics and enhancing the performance of energy storage devices. Composite materials comprised of metallic fillers and a polymer matrix are of great interest to be implemented as hybrid conductive adhesives. Here we investigated a cost-effective conductive adhesive material consisting of silver-coated copper as micro-fillers using synchrotron-based three-dimensional (3D) X-ray nano-tomography. The key factors affecting the quality and performance of the material were quantitatively studied in 3D on the nanometer scale for the first time. A critical characteristic parameter, defined as a shape-factor, was determined to yield a high-quality silver coating, leading to satisfactory performance. A ‘stack-and-screen’ mechanism was proposed to elaborate such a phenomenon. The findings and the technique developed in this work will facilitate the future advancement of conductive adhesives to have a great impact in micro-electronics and other applications.