Residual Stress Measurement by X-Rays: Errors, Limitations and Applications

In a recent Air Force Materials Conference on residual stress analysis the fact that x-ray diffraction was the only non-destructive method presently available which could measure residual stresses in most crystalline materials, i.e., metals and ceramics, was acknowledged. However, it was also recognized that for the many successful applications there were also a number of mis-applications due to inexperience, over-optimism of just plain poor procedures on the part of the engineer or technician performing the measurements. Finally it was concluded that the greatest impediment to greater applications of the x-ray stress method was the limited field adaptability and portability of existing instrumentation.