Soldering of Graphene Assembled Films with Ultrasonic Assistance and Its Utilization Potentiality in Electronic Devices

In this study, inspired by ultrasonic-assisted soldering technique, we proposed the soldering method for GAF with ultrasonic assistance. Sn solder spot were firstly prepared on GAF terminates ultrasonically, and then remelted to realize soldering of GAF. As a result, GAF was successfully soldered with ultrasonic assistance. The optimal ultrasonic vibration time should be 10 seconds for the preparation of Sn solder spot. Under the action of ultrasonic waves, Sn solder was driven to not only wet and spread on GAF surface, but also squeeze into GAF interlayers, which allowed the Sn solder spots to form a mechanically interlocked tight bonding with GAF. Furthermore, a compact interface of GAF/amorphous carbon (a-C) layer/Sn was formed. Significantly, GAF soldered joints exhibited high tensile resistance and excellent electrical property closed to original GAF. All the findings can promote the application and development of GAF in the field of electronic devices.