1.55 μm hybrid waveguide laser made by ion-exchange and wafer bonding
2012
Distributed Feed Back (DFB) lasers working in the third telecom window are essential for optical communications, eyesafe
sensors and lab-on-chip devices. Glass integrated optics technology allows realizing such devices by using rareearth
doped substrates. Despite their good output power and spectral characteristic, DFB lasers still present some
reliability issues concerning the Bragg grating protection. Moreover Erbium doped glasses are not compatible with the
realization of passive optical functions. In order to solve the DFB lasers reliability issues and to ensure a monolithic
integration between active and passive functions, we propose an hybrid-device architecture based on ion-exchange
technology and wafer bonding. The Ag + /Na + ion-exchange in the silicate glass wafer is used to realize the passive
functions and the lateral confinement of the electromagnetic field. Through a second ion exchange step, a slab
waveguide is made on the Erbium-Ytterbium doped glass wafer. The Bragg grating is processed on the passive substrate
and the two glasses are bonded. The potential of this structure has been demonstrated through the realization of a DFB
hybrid laser with a fully encapsulated Bragg grating.
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