Laminates and kits

Provided are a laminate having an organic semiconductor film, a water-soluble resin layer, and a photosensitive resin layer, in which cracks are unlikely to occur, and a kit. A water-soluble resin layer containing a water-soluble resin and a photosensitive resin layer containing a photosensitive resin are included in this order on the organic semiconductor film, and the water-soluble resin layer and the photosensitive resin layer are adjacent to each other. The resin is at least one of polyvinyl pyrrolidone having a weight average molecular weight of 300,000 or more and polyvinyl alcohol having a weight average molecular weight of 15,000 or more, and the photosensitive resin has a weight average molecular weight of 30,000 or more.