Connecting structural adhesive composition and film-like circuit component adhesive

The present invention provides a connection structure of the adhesive composition, the film-like adhesive and the circuit member. The present invention relates to application of the adhesive composition as a circuit connecting material, wherein said adhesive composition comprising (a) comprises the (meth) acrylic acid alkyl ester - butadiene - styrene copolymer, or complex, (meth) acrylic acid alkyl ester - silicone copolymer or silicone compound and - at least one substance (meth) acrylic acid copolymer or a complex selected from the group consisting of organic fine particles, the pair of circuit parts of the circuit-connecting material for bonding according disposed opposite the pair of circuit member circuit electrodes has to be electrically connected to each other.