A study on machining of single crystal diamond by femtosecond laser for fabrication of grinding tools with positive rake angle

Molecular dynamics simulation showed that by using abrasive grain with positive rake angle, the surface/subsurface damage and grinding force in the process of hard and brittle materials machining will be reduced significantly. In view of this, ablating single crystal diamond (SCD) plate by femtosecond laser to create a novel face grinding tool with acute inclination angle at the edge of the micro grains was proposed in this paper. A Ti: Sapphire femtosecond laser with wavelength of 1030nm and pulse width of 250fs was used for the ablation experiments. The effects of processing parameters on the ablation depth, ablation width and surface quality of diamond were investigated systematically. Under the current.