A method of manufacturing an organic semiconductor device and an organic semiconductor component

The invention relates to a method for producing an organic semiconductor component (2) which is manufactured as a multilayer structure, particularly an OPV module, comprising an upper electrode (4), a lower electrode (6) and a between the electrodes (4, 6) arranged active layer (8), for electrically connecting the two electrodes (4, 6) has a via (18) is formed, characterized in that the plated-through hole (18) from a within a predetermined pressure range (D) printed ink (22) is formed. Furthermore, the invention relates to a product manufactured by such a method organic semiconductor component (2).