A numerical investigation on the effects of mixed convection of Ag-water nanofluid inside a sim-circular lid-driven cavity on the temperature of an electronic silicon chip

Abstract In the current study, a laminar and mixed flow of water/Ag nanofluid in an electronic chip influenced by the cooling performance of a novel semi-circular lid-driven cavity has been numerically investigated by employing the finite volume method. The Effect of the nanoparticle volume fraction, Richardson number and angle of attack of a semi-circular lid-driven cavity on the heat transfer (cooling performance) and physics of flow have been investigated. The results showed that by moving the heated fluid in the channel, the heat transfer performance in the cavity leads to the reduction of the temperature of the heated fluid along its direction. Furthermore, changing the angle of attack of the cavity leads to the distinction of the heat transfer process and the creation of a different quantitative level of Nusselt number for various states. According to the results, increase the angle of attack to 45° and 90°, the Nusselt number reduced more than 40%. Moreover, at the angle of attack 0°, the skin friction is 0.002, and it is reduced to the 0.0008 and 0.00015 at the angle of attack 90° and −90°, respectively. Among the studied angles, the best heat transfer between the silicon chip and the cavity is related to the angle of attack −45°, 0°, −90°, 45°, and 90°, respectively.