Laser module and a manufacturing method thereof

A submount (10), and semiconductor lasers which are fixed to the submount surface (3), so that the semiconductor laser and the optical coupling, bonded optical waveguide device with an adhesive layer on the submount surface (11) (2) provided with a door. The submount surface in the area corresponding to the optical waveguide device entrance end, a first groove parallel to the semiconductor laser emitting end face is provided a predetermined distance (12) is formed. The adhesive layer edge in the optical waveguide device incident end side is positioned in a range from the position in contact with the farther edge from the semiconductor laser of the first groove across the first groove, and a semiconductor laser emitting end face It is formed so as not to contact. Since the adhesive layer can be positioned in a suitable range, it is possible to suppress the coupling deviation caused by the distortion due to thermal changes.