Method for inducing growth of intermetallic compound with specific grain orientation and specific number of films through laser forward transfer printing

The invention discloses a method for inducing growth of an intermetallic compound with the specific grain orientation and the specific number of films through laser forward transfer printing. The method comprises the following steps that firstly, a seed layer is prepared on the surface of a substrate; secondly, a metal film is continuously prepared on the surface of the seed layer; thirdly, the Sn film is prepared on the surface of metal film; fourthly, the substrate and the two films are heated, so that the intermetallic compound film is prepared; fifthly, the intermetallic compound film is transferred to the surfaces of a chip and bonding pads of the substrate respectively; sixthly, the surface of the intermetallic compound film is plated with the Sn film; and seventhly, the bonding pads are in butt joint, pressure is applied, the bonding pads are placed in a reflow furnace, and the stages of preheating, heat preservation, reflowing and cooling are performed. By the adoption of the method, the preparation time of a welding spot of the intermetallic compound capable of being used for high-temperature packaging and interconnection is greatly shortened, the grain orientation and the number of following growing intermetallic compounds are controlled, the welding spot of the intermetallic compound is quickly prepared, and the microstructure is controllable.