Inorganic filler composite, thermally conductive resin composition, and molded article

In previous resin composition, sufficient thermal conductivity can not be obtained, or there is a defect such as poor moldability it is necessary to add a large amount of filler for thermal conductivity improved. An object of the present invention is to provide a good moldability thermoplastic resin composition, even if the volume content of the inorganic filler contained in the composition is small, the molded body which exhibits excellent thermal conductivity , and to provide a resin composition for use in molded article. Providing particulate on the surface of the thermally conductive filler, angular, fibrous, at least one boehmite having a shape, or zinc oxide is a bond or adhere to configured inorganic filler composite shape consisting of flat Accordingly, to solve the above problem.