Pellicle assembly and method for improved lithography

The present disclosure provides an apparatus for a semiconductor lithography process, according to some embodiments. The apparatus comprises a pellicle membrane having a thermally conductive surface; a porous pellicle frame; and a thermally conductive adhesive layer which secures the pellicle membrane to the porous pellicle frame. The porous pellicle frame comprising a plurality of pore channels, which extend continuously from an outer surface of the porous pellicle frame to an inner surface of the porous pellicle frame.