Recording heads with track widths suitable for 100 Gbit/in/sup 2/ density

Focused ion beam etching has been used to trim both longitudinal and perpendicular recording heads with track widths as narrow as 60 nm. 3D boundary element modeling has been used to optimize trimming parameters. Tracks written with the trimmed heads using spin-stands and imaged using magnetic force microscopy were as narrow as 100 nm.