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A Mixed Solder Grid Array And Peripheral Leaded Mcm Package
A Mixed Solder Grid Array And Peripheral Leaded Mcm Package
1993
H Hashemi
M. Olla
D. Cobb
M. McShane
G Hawkins
P Lin
Keywords:
Digital signal processor
Engineering
Electronic engineering
Soldering
Grid
Chip
Embedded system
Peripheral
Electronic packaging
Printed circuit board
Electrical engineering
Correction
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