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Acemap > Paper > Relation between Microstructure and Electric Resistivity of Copper, Nickel, NixCu1-x Alloys and Ni/Cu Bilayered Thin Films.

Relation between Microstructure and Electric Resistivity of Copper, Nickel, NixCu1-x Alloys and Ni/Cu Bilayered Thin Films.

2015 
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