Preparation and characterization of ultralow dielectric and fibrous epoxy thermoset cured with poly(arylene ether ketone) containing phenolic hydroxyl groups

Abstract Poly(arylene ether ketone) containing naphthalene and phenolic hydroxyl groups (HPAEK) was prepared by polycondensation and demethylation reaction. Polymer cured epoxy resin with high- Tg was obtained through reactions between oxirane ring of epoxy and phenolic hydroxyl groups of HPAEK. Electrospinning technology was used to fabricate porous film. The porous film shows a high Tg value (262 °C), a low dielectric constant (1.9 at 1 MHz), and a low coefficient of thermal expansion (52 ppm °C −1 ). The thermal stability and water contact angle were also measured. The naphthalene and phenolic hydroxyl containing poly(arylene ether ketone) provides us with a new strategy to achieve ultralow dielectric constant materials via electrospinning.