On the use of topology optimization for improving heat transfer in molding process

In the plastic industry, one of the key factor is to control heat transfer. One way to achieve that goal is to design an effective cooling system. But in some area of the mold, where it is not possible to design cooling system, the use of a highly conductive material, such as copper pin, is often used. Most of the time, the location, the size and the quantity of the copper pin are made by empirical considerations, without using optimization procedures. In this article, it is proposed to use topology optimization, in order to improve transient conductive heat transfer in an injection/blowing mold. Two methodologies are applied and compared. Finally, the optimal distribution of cooper pin in the mold is given.