Interpixel cross-talk in a 3D-integrated active pixel sensor for X-ray detection

MIT Lincoln Laboratories and MIT Kavli Institute for Astrophysics and Space Research have developed an active pixel sensor for use as a photon counting device for imaging spectroscopy in the soft X-ray band. A silicon-on-insulator (SOI) readout circuit was integrated with a high-resistivity silicon diode detector array using a per-pixel 3D integration technique developed at Lincoln Laboratory. We have tested these devices at 5.9 keV and 1.5 keV. Here we examine the interpixel cross-talk measured with 5.9 keV X-rays.