New Approach for the Preparation of Nanoporous Polyorganosilicate Low-k Films

The distribution of pores and the mechani- cal properties of materials are the key factors in preparing satisfactory low-k films. In the present study, a kind of sil- sesquioxane-polyethylene glycol (SSQ-PEG) was synthe- sized and used as a template to make the distribution of pores more even in the low-k films. The crosslinking den- sity of films could be adjusted by the sol-gel of tetrame- thoxysilane/dimethoxydimethylsilane with various pro- portions. The porosity of films could also be adjusted with different proportions of pendant PEG chains introduced. A dielectric constant as low as 2.1 had been achieved for nano- porous polyorganosilicate films with good tenacity. 2006