Interfacial reaction between liquid Sn-20In-2.8Ag solder and Ag substrate
2002
Abstract The morphology and growth kinetics of the intermetallic compound formed during the reaction between liquid Sn-20In-2.8Ag solder and Ag substrate are studied in the temperature range 225–325 °C. The results indicate that the intermetallic compound Ag2+x(In, Sn) of scallop shape appears at the interface. The intermetallic thickness versus reaction time shows a parabolic relation, indicating that the growth of this intermetallic is diffusion-controlled. The activation energy calculated from the Arrhenius plot of the intermetallic growth rate is 41.6 kJ/mol. By marking the original interface with a Ta thin film, the dissolution of Ag into solder and the growth mechanism of the intermetallic compound have been clarified.
Keywords:
- Correction
- Source
- Cite
- Save
- Machine Reading By IdeaReader
11
References
7
Citations
NaN
KQI