Technology platform for 3-D stacking of thinned embedded dies

This paper presents results on the process for the embedding and 3D stacking of thin dies developed at IMEC. The embedding build-up is composed of photosensitive dielectric BCB and Copper plated metal films. Successful embedding of 15 mum thick Si dies is shown and electrical connection to pads having a dimension of 35 mum is shown. Preliminary results on stacking will also be presented. Those results include removal of the Si carrier from the embedded structures. This technique can also be used for the production of thin polymer foils with embedded dies. Results on thin foil fabrication will also be reported.