Old Web
English
Sign In
Acemap
>
Paper
>
Fracture Dynamics during the Silicon Layer Transfer of the Smart Cut™ Process
Fracture Dynamics during the Silicon Layer Transfer of the Smart Cut™ Process
2014
Damien Massy
F. Mazen
Jennifer Ragani
F. Madeira
Didier Landru
F. Rieutord
Keywords:
Smart Cut
Materials science
Mechanical engineering
Silicon
Correction
Source
Cite
Save
Machine Reading By IdeaReader
0
References
0
Citations
NaN
KQI
[]