Extended photon emission camera for thermal emission detection

In this study, we demonstrate the use of the extended spectrum of the short-wave infrared DBX Emission System to detect thermal emission with a high enough resolution to perform physical failure analysis. The case study was performed on a 16nm technology System On Chip (SOC) memory access circuitry. Multiple optical filters were used in the analysis in order to isolate the few emission spots that were the consequence of the root cause defect. The physical analysis was performed using TEM/EDX and highlighted a resistive short between two NFET gate contacts.