A Fast Technique for Realization of Lumped-Element Values Into 3-D Physical Layout on LTCC

This article proposes a methodology for the fast translation of ideal lumped-element values to the form of a 3-D physical layout using low-temperature cofired ceramic (LTCC) dielectric. It is explained how this approach is implemented without requiring complex formulas and uses a simulation-based process which leads to consume less optimization/tuning processing time. The proposed methodology is applied to the design of a dual-band bandpass filter (D-BPF) operating at center frequencies 2.4 and 5.2 GHz and its layout is realized in the form of 3-D physical layout. The two commercial simulators, advanced design system (ADS) and high-frequency structure simulator (HFSS), are used to simulate ideal lumped-element schematics and perform electromagnetic (EM) simulations on the LTCC layout, respectively.