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Design and Test of a Low Junction-to-Case Thermal Resistance Packaging Method
Design and Test of a Low Junction-to-Case Thermal Resistance Packaging Method
2021
Jiahao Wu
Yanmei Kong
Zhu Shengli
Yawei Xu
Jianyin Miao
Liu Ruiwen
Yun Shichang
Ye Yuxin
Binbin Jiao
Keywords:
Thermal resistance
test
Composite material
Materials science
Correction
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