Comprehensive Characterization of Voids and Microstructure in TATB-based Explosives from 10 nm to 1 cm: Effects of Temperature Cycling and Compressive Creep

This paper outlines the characterization of voids and Microstructure in TATB-based Explosives over several orders of magnitude, from sizes on the order of 10 nm to about 1 cm. This is accomplished using ultra small angle x-ray scattering to investigate voids from a few nm to a few microns, ultra small angle neutron scattering for voids from 100 nm to 10 microns, and x-ray computed microtomography to investigate microstructure from a few microns to a few centimeters. The void distributions of LX-17 are outlined, and the microstructure of LX-17 is presented. Temperature cycling and compressive creep cause drastically different damage to the microstructure. Temperature cycling leads to a volume expansion (ratchet growth) in TATB-based explosives, and x-ray scattering techniques that are sensitive to sizes up to a few microns indicated changes to the void volume distribution that had previously accounted for most, but not all of the change in density. This paper presents the microstructural damage larger than a few microns caused by ratchet growth. Temperature cycling leads to void creation in the binder poor regions associated with the interior portion of formulated prills. Conversely, compressive creep causes characteristically different changes to microstructure; fissures form at binder-rich prill boundaries priormore » to mechanical failure.« less