Research on Electrical Characteristics of Multi-chip Itegration for the Fifth-Generation Communication

With the advent of the fifth-generation (5G) wireless communication era, the demand for low cost, lightweight, low profile and satisfied transmission performance packages is urgent. Microsystem integration technology based on silicon-based process can meet the miniaturization requirements of heterogeneous integration in 5G front-end applications. This paper focuses on the impedance matching for the impedance discontinuities mainly caused by bonding wires and through silicon vias. The matching structures are rationally designed based on the microwave transmission line theory and the structure parameters are reasonably optimized. Finally, the whole interconnection link with the use of designed matching models obtains a good transmission performance at millimeter wave frequencies.