Problem of laser impulse microshaping quality: analysis and synthesis

Today the laser technologies are widely used in the processing of materials, including also the technologies of the precise micromachining. UV and X-ray lasers have very good prospects in the lithography, used for fabrication of chips, while the femtosecond pulsed lasers open the new horizons for the micro- and submicroscribing. But these are the prospects. As for today state-of-the-art, contributing to the application of lasers for these purposes are the numerous advantages of the laser techniques over the traditional methods, such as wide variety of materials separated, possibility of achieving narrow cuts and practically waste-free separation, small heat-affected zone, minimal mechanical effect and minimal thermal deformations, possibility of fast and precise process switch-on and off, possibility of separation along a complex profile in two, or even three, dimensions.