Detecting abnormal rigid columns knuckles which are formed above a metallization

disclosed herein subject matter generally relates to a testing formed on a semiconductor chip pillar bumps, to detect the presence of abnormal solid column bumps. One illustrative method disclosed herein comprises placing a test sample adjacent to one side of a pillar bump formed over a metallization of a semiconductor chip, and performing a lateral force tests on the pillar bumps by contacting the side of the pillar bump with the test sample during a moving of the test sample with a substantially constant speed that is less than about 1 .mu.m / s.