Highly accurate wiring fabrication technologies by plasma dry processes for 3D-IC and fan-out packaging

Smart ICT (Information and Communication Technology) such as “Big Data”, “Cloud computing” and Smart Functionalities such as Stand-alone Self-activating MEMS/Sensors construct Smart Systems which enable IoT (Internet of Things), IoE (Internet of Everything) thus Smart Society. To realize above-mentioned Smart Technologies, high-density, low-power consumption, wide-bandwidth, fast-operation semiconductor devices as well as smart functional devices enabled by integrating functionalities with advanced semiconductor technologies including CMOS technologies are necessary. High-density Packaging technologies such as 3D, 2.5D packaging scheme basing on TSV (through-Si via) technology and 2.1D PWB packaging are among key technologies to satisfy the requirements from the both smart semiconductor devices and smart functional devices. Meanwhile MEMS/Sensors are required as muti-functionalities of stand-alone smart devices for wearable devices including smart phone, an important part of Smart Systems. ULVAC has been continuously developing manufacturing solutions for Smart Technologies. In this talk, our high-density packaging technologies including scallop-free, low-temperature processed TSV solution for via-last packaging scheme and 2.1D packaging solutions on large panel build-up PWB will be introduced.