Electrodeposition of Nb3Sn Alloy Film from Lewis Basic NbCl5-SnCl2-EMIC Melt

The electrodeposition of the Nb3Sn alloy film from the Lewis basic NbCl5-SnCl2-EMIC melt (50 mol%melting point or glass transition point and molar fraction of NbCl5 was constructed for the NbCl5-EMIC system, which showed a melting point less than room temperature in the range of 10.0 mol%≤molar fraction of NbCl5≤33.3 mol%. From the results of the cyclic voltammograms, the possibility of electrodeposition of the Nb3Sn alloy film was suggested from the Lewis basic melt. The Nb3Sn alloy film was reproducibly obtained from the 19.2 mol% NbCl5–10.0 mol% SnCl2–70.8 mol% EMIC bath using a constant current pulse electrodeposition method at 0.1 A cm−2 with a pulse period of 10 ms, duty ratio of 0.20, and electricity of 50°C cm−2 at 130°C, although the existence of the metallic Sn simple substance and the Cu-Sn alloy in the film was confirmed by an XRD analysis.