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Acemap > Paper > Enhanced thermal and mechanical properties of PW‐based HTPB binder using polystyrene (PS) and PS–SiO2 microencapsulated paraffin wax (MePW)

Enhanced thermal and mechanical properties of PW‐based HTPB binder using polystyrene (PS) and PS–SiO2 microencapsulated paraffin wax (MePW)

2018 
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