Old Web
English
Sign In
Acemap
>
Paper
>
A Pin Pull Test A Pin Pull Test to Assess the Adhesion of Thin Film Conductors on LTCC Substrates.
A Pin Pull Test A Pin Pull Test to Assess the Adhesion of Thin Film Conductors on LTCC Substrates.
2013
Paul T. Vianco
Jerome A. Rejent
John Mark Grazier
Peter S. Duran
Alice C. Kilgo
Bonnie Beth McKenzie
Amy Allen
Esteban Guerrero
William Price
Keywords:
Thin film
Electronic engineering
Materials science
Adhesion
Electrical conductor
Composite material
Correction
Source
Cite
Save
Machine Reading By IdeaReader
0
References
0
Citations
NaN
KQI
[]