Simple fabrication of copper surfaces with tunable wettability and multi-level structures via one-step method

Abstract Copper surfaces, with nanowire, microflower and nanowire/microflower hierarchical structures, were fabricated by a simple and convenient one-step approach without any further treatment. Variation of fine structure, composition, surface roughness and wettability on copper surfaces with etching time and etching solution was systemically investigated. Results revealed that with a little difference in etching time, wettability could change a lot, from high hydrophobicity to superhydrophilicity. What’s more, the mechanism of difference in wettability of copper surfaces, etched by different concentrations of etching solution, was clarified. Surface composition and morphology were in the wettability of copper surfaces.