Thermal-structural analysis for the water-cooling plate of press-pack IGBT series-connected valve and structure optimization for the valve

The mounting force control of the press-pack IGBT series-connected valve is one of the important indexes to measure the reliability. Especially, when the press-pack IGBT series-connected valve is working, the influence of temperature change in the valve on its mounting force is worthy of attention. In this paper, a press-pack IGBT series-connected valve in VSC is studied. Based on the analysis to thermal-structure coupling simulation of the water-cooling plate in the valve , this paper obtains the thermal deformation of the water-cooling plate when the press-pack IGBT series-connected valve are working , further analyzes and proves the effects of the thermal deformation of the water-cooling plate caused by temperature change in the press-pack IGBT series-connected valve to mounting force of the valve, and presents an optimal structure design of the press-pack IGBT series-connected valve.