Annealing effect on temperature stability and mechanical stress at the “Cd x Pb 1−x S film – substrate” interface

The article establishes the upper temperature steadiness limit of Сd x Pb 1 - x S supersaturated solid solutions obtained by chemical bath deposition. Сd x Pb 1 - x S ( x = 0.06; 0.122; 0.176) and ( x = 0.02–0.05) films remained stable under the heating up to 405–410 and 450 K, respectively. SEM studies have shown that heating of Сd x Pb 1 - x S films ( x = 0.02–0.05) to 620 K leads to the structure destruction. Internal mechanical compressive stresses at the "Сd x Pb 1 - x S film-substrate" interface was calculated in the range of 300–900 K for the first time ever, the highest values reached 2000–2750 kN/m 2 for a number of the films compositions. In contrast to solid solutions, the expansion stresses up to 100 kN/m 2 were derived for the CdS layer at 900 K. The obtained temperature steadiness boundaries and the mechanical stresses of Сd x Pb 1 - x S films must be taken into account in the development of photonic devices based on such materials.