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Electromigration-driven void nucleation and growth in 30nm wide Cu line: Metal cap impact on interfacial Cu diffusion
Electromigration-driven void nucleation and growth in 30nm wide Cu line: Metal cap impact on interfacial Cu diffusion
2013
Tomoyuki Kirimura
Kristof Croes
Yong Kong Siew
Kris Vanstreels
Piotr Czarnecki
Zaid El-Mekki
Marleen H. van der Veen
Dries Dictus
Alex Yoon
Artur Kolics
Juergen Boemmels
Zsolt Tokei
Keywords:
Electromigration
Void (astronomy)
Materials science
Nucleation
Metallurgy
Metal
void nucleation
Correction
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