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New Generation of Structures Obtained by Direct Wafer Bonding of Processed Wafers
New Generation of Structures Obtained by Direct Wafer Bonding of Processed Wafers
2006
Bernard Aspar
Chrystelle Lagahe-Blanchard
Nicolas Sousbie
Jacques Margail
H. Moriceau
Keywords:
Anodic bonding
Wafer backgrinding
Wafer
Wafer bonding
Materials science
Composite material
Optoelectronics
Correction
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