Influence of the Temperature And Humidity Conditions on the Adhesive Interaction of Spores of the Aspergillus niger Fungus with Varnished Cambric

It is shown that the parameter of the adhesion process—the maximum number of fungal spores adhering to polymeric materials—makes it possible to assess the ability of the Aspergillus niger (A. niger) fungus and varnished cambric to adhesive interaction in various temperature and humidity conditions. The value of this parameter is determined mainly by humidity and practically does not depend on the ambient temperature. An analytical dependence of the maximum adhesion number on air humidity is obtained. The research results can be used to develop methods for assessing and forecasting the contamination of materials by microorganisms-destructors in various climatic conditions.