High performance wideband MSAG gain block/driver amplifier MMICs using mlp technology

The multi-level plating (MLP) process has been used to develop a family of wideband, low noise, generic gain block and driver amplifier MMICs operating up to 20 GHz. MLP implementation provides significant performance improvements over standard MMIC processing techniques, especially with regards to bandwidth and gain. This article discusses salient features of the MLP process, including test data for multilayer microstrip lines, spiral inductors, 3 dB couplers and MLP-based MMIC amplifiers. The design approach and test data for several broadband MMICs, including a low noise amplifier, a single-bias gain block, and 0.25 W and 0.7 W driver amplifiers, are also deserved.