Conductive-paste-based high-yielding interconnection process for c-Si photovoltaic modules with 50 µm thin cells

Abstract Thin crystalline silicon (c-Si) photovoltaic (PV) cells (  200 °C) soldering causes frequent wafer breakage in thin c-Si-based modules. Hence, in this work, we proposed low-temperature interconnection method using conductive paste (CP) for thin c-Si PV modules and systematically studied the modules’ electrical and mechanical properties as a function of annealing temperature of CP. The potential advantage of this method is significantly reduced wafer bowing due to the low-temperature tabbing (