Comparison of High Performance Cooling Concepts for SiC Power Modules

In this paper, a comparison of different cooling concepts for a commercially available off-the-shelf silicon carbide (SiC) module is investigated. A systematical approach regarding not only thermal resistance and volume flow but also pressure drop and pump power is performed. This work differs from other publications in that particular focus is laid upon impinging jet cooling of a SiC semiconductor-modules bare ceramic direct-bond-copper (DBC) substrat.