Thermal and Power Delivery Aware Floorplanning for Heterogeneous Multi Core Design

Heat removal and power integrity have become major concerns in floor-planning of heterogeneous multi core in system on a chip (SOC). Heterogeneous multi core brings new challenges to balance thermal and power point of view because optimal floor-plan is different for each perspective. This paper proposes weighted cost function that can consider thermal and power delivery together. We discuss methodology for cost function formulation covering multi-physics. The case study of SOC having 8 cores CPU was presented to illustrate our approach. Thermal and power delivery analysis result shows difference result for each perspective, but after converting thermal and PI characteristics improvement into package cost by multiplying their improvement and package cost per improvement, we could figure out the best floor-plan having minimum cost is thermally best floorplan because the majority of cost was originated from thermal characteristics. Finally, our approach gives promising improvements of peak temperature with a reduced overhead in power delivery.