Thermosetting reaction resin composition

PURPOSE: To improve working properties and to obtain an inexpensive reaction resin molding material by mixing a polyfunctional epoxide not containing phosphorus, a specified phosphorus compound containing an epoxy group, a polyfunctional isocyanate, a curing catalyst, and a filler. CONSTITUTION: (a) A multifunctional epoxide not containing phosphorus, (b) a phosphorus compound containing an epoxy group of a formula [m is 0-1; n is 0-2; o is 1-3, m+n+o=3; p is n; X is a free electron pair, O, S bonded through a double bond; R is 1-4 C alkyl bonded directly or through O or S, 2-3 C alkenyl, aryl, aralkyl, dialkylamino, alkyl arylamino, 3-trialkylsilyl-propyl; R' is O, S, (dioxy)phenylene, dioxynaphthylene, formulas II-V (r is 1-3; s is 1-8), bridge consisting of formulas VI-VIII (t is 2-100); A 1-2 are single bond, bridge corresponding to R'] in which the mole ratio between the epoxy functional groups of (a) and (b) components is 1-4:4-1, (C) polyfunctional isocyanate in which the mole ratio between an epoxy group and an NCO group is 1-5:5-1, (D) a curing catalyst, and as required (E) a filler are mixed. COPYRIGHT: (C)1991,JPO