Multi-terminal low inductance capacitor delamination failure

The following details a new test methodology offered as a cost effective alternative to module form-factor testing for detecting the delamination fail mode observed in Multiterminal low inductance capacitors (MTLICs) under temperature humidity bias (THB) reliability stress testing. This MTLIC test methodology yields the same delamination reliability failure-mode as observed in the module form-factor. We draw on this new testing methodology to highlight the influence of packaging materials, module form factor and component supplier on THB reliability performance of MTLIC components.